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VULNERABILITIES

CVE-2026-21385 Details

Description

Memory corruption while using alignments for memory allocation.

Metrics

CVSS 3.x Severity and Vector Strings:

CNA: [email protected]CVSS-B:7.8 HIGHVector:CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

References to Advisories, Solutions, and Tools

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URLSource(s)Tag(s)
https://source.android.com/docs/security/bulletin/2026/2026-03-01 CISA-ADPVendor Advisory
https://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2026-21385 CISA-ADPUS Government Resource
https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2026-bulletin.html [email protected]PatchVendor Advisory

This CVE is in CISA's Known Exploited Vulnerabilities Catalog

Reference CISA's BOD 22-01 and Known Exploited Vulnerabilities Catalog for further guidance and requirements.

Vulnerability NameDate AddedDue DateRequired Action
Qualcomm Multiple Chipsets Memory Corruption VulnerabilityMar 3, 2026Mar 24, 2026Apply mitigations per vendor instructions, follow applicable BOD 22-01 guidance for cloud services, or discontinue use of the product if mitigations are unavailable.

Weakness Enumeration

CWE-IDCWE NameSource
CWE-190Integer Overflow or Wraparound[email protected]

Affected Products

ProductVersions

Change History

8 change records found show changes

QUICK INFO

CVE Dictionary Entry:
CVE-2026-21385
NVD Published Date:
Mar 2, 2026
NVD Last Modified:
Jun 17, 2026
Source:
[email protected]
CVE-2026-21385 Details - Not Deferred